International Journal on Advanced Science, Engineering and Information Technology

Vlasov, Andrey I., Department of Design and Technology of Electronic Devices, Bauman Moscow State Technical University, 5/1, 2-aj Baumanskaj Str., Moscow, 105005, Russian Federation, Russian Federation

• Vol 10, No 3 (2020) - Articles
  Use of the “Via-In-Pad†Method to Ensure the High-Density Layout of the Conductive Pattern when Designing Multilayer Switching Structures
  Abstract  PDF