Author Details
Kondakov, Nikita A., Department of Design and Technology of Electronic Devices, Bauman Moscow State Technical University, 5/1, 2-aj Baumanskaj Str., Moscow, 105005, Russian Federation, Russian Federation
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Vol 10, No 3 (2020) - Articles
Use of the “Via-In-Pad†Method to Ensure the High-Density Layout of the Conductive Pattern when Designing Multilayer Switching Structures
Abstract
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Published by INSIGHT -
Indonesian Society for Knowledge and Human Development