Ivan E. Chernov

Department of Design and Technology of Electronic Devices, Bauman Moscow State Technical University, 5/1, 2-aj Baumanskaj Str., Moscow, 105005, Russian Federation


  1. Vol. 10 (2020) No. 3
    Use of the “Via-In-Pad” Method to Ensure the High-Density Layout of the Conductive Pattern when Designing Multilayer Switching Structures
    Ivan E. Chernov, Nikita A. Kondakov, Konstantin D. Perederin, Andrey I. Vlasov, Vladimir P. Zhalnin, Vadim A. Shakhnov